Handbook of 3D Integration, Volume 4 Design, Test, and Thermal Management 1st Edition

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Handbook of 3D Integration: Design, Test, and Thermal Management, Volume 4

Editor(s):

Paul D. FranzonErik Jan MarinissenMuhannad S. Bakir


First published:8 February 2019

Print ISBN:9783527338559 |Online ISBN:9783527697052 |DOI:10.1002/9783527697052

© 2019 Wiley‐VCH Verlag GmbH & Co. KGaA

About this book

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective.

Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.

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Table of Contents

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Free Access

Front Matter (Pages: i-xvii)


Part I : Design

CHAPTER 1

3D Design Styles (Pages: 1-19)


Paul D. Franzon

CHAPTER 2

Ultrafine Pitch 3D Stacked Integrated Circuits: Technology, Design Enablement, and Application (Pages: 21-40)


Dragomir Milojevic Prashant Agrawal Praveen Raghavan Geert Van der Plas Francky Catthoor Liesbet Van der Perre Dimitrios Velenis Ravi Varadarajan Eric Beyne

CHAPTER 3

Power Delivery Network and Integrity in 3D-IC Chips (Pages: 41-52)


Makoto Nagata

CHAPTER 4

Multiphysics Challenges and Solutions for the Design of Heterogeneous 3D Integrated System (Pages: 53-79)


Alexander Steinhardt Dimitrios Papaioannou Andy Heinig Peter Schneider

CHAPTER 5

Physical Design Flow for 3D/CoWoS® Stacked ICs (Pages: 81-114)


Yu-Shiang Lin Sandeep K. Goel Jonathan Yuan Tom Chen Frank Lee

CHAPTER 6

Design and CAD Solutions for Cooling and Power Delivery for Monolithic 3D-ICs (Pages: 115-140)


Sandeep Samal Sung K. Lim

CHAPTER 7

Electronic Design Automation for 3D (Pages: 141-147)


Paul D. Franzon

CHAPTER 8

3D Stacked DRAM Memories (Pages: 149-186)


Christian Weis Matthias Jung Norbert Wehn

Part II : Test

CHAPTER 9

Cost Modeling for 2.5D and 3D Stacked ICs (Pages: 187-208)


Mottaqiallah Taouil Said Hamdioui Erik Jan Marinissen

CHAPTER 10

Interconnect Testing for 2.5D- and 3D-SICs (Pages: 209-230)


Shi-Yu Huang

CHAPTER 11

Pre-Bond Testing Through Direct Probing of Large-Array Fine-Pitch Micro-Bumps* (Pages: 231-252)


Erik Jan Marinissen Bart De Wachter Jörg Kiesewetter Ken Smith

CHAPTER 12

3D Design-for-Test Architecture (Pages: 253-280)


Erik Jan Marinissen Mario Konijnenburg Jouke Verbree Chun-Chuan Chi Sergej Deutsch Christos Papameletis Tobias Burgherr Konstantin Shibin Brion Keller Vivek Chickermane Sandeep K. Goel

CHAPTER 13

Optimization of Test-Access Architectures and Test Scheduling for 3D ICs (Pages: 281-300)


Sergej Deutsch Brandon Noia Krishnendu Chakrabarty Erik Jan Marinissen

CHAPTER 14

IEEE Std P1838: 3D Test Access Standard Under Development (Pages: 301-323)


Adam Cron Erik Jan Marinissen Sandeep K. Goel Teresa McLaurin Sandeep Bhatia

CHAPTER 15

Test and Debug Strategy for TSMC CoWoS ® Stacking Process-Based Heterogeneous 3D-IC: A Silicon Study (Pages: 325-346)


Sandeep K. Goel Saman Adham Min-Jer Wang Frank Lee Vivek Chickermane Brion Keller Thomas Valind Erik Jan Marinissen

Part III : Thermal Management

CHAPTER 16

Thermal Isolation and Cooling Technologies for Heterogeneous 3D- and 2.5D-ICs (Pages: 347-373)


Yang Zhang Hanju Oh Yue Zhang Li Zheng Gary S. May Muhannad S. Bakir

CHAPTER 17

Passive and Active Thermal Technologies: Modeling and Evaluation (Pages: 375-412)


Craig E. Green Vivek Sahu Yuanchen Hu Yogendra K. Joshi Andrei G. Fedorov

CHAPTER 18

Thermal Modeling and Model Validation for 3D Stacked ICs (Pages: 413-432)


Herman Oprins Federica Maggioni Vladimir Cherman Geert Van der Plas Eric Beyne

CHAPTER 19

On the Thermal Management of 3D-ICs: From Backside to Volumetric Heat Removal (Pages: 433-460)


Thomas Brunschwiler Gerd Schlottig Chin L. Ong Brian Burg Arvind Sridhar

Free Access

Index (Pages: 461-470)




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