Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits

Editor(s):

Dr. Philip Garrou, Dr. Christopher Bower, Dr. Peter Ramm

First published:6 August 2008

Print ISBN:9783527320349 |Online ISBN:9783527623051 |DOI:10.1002/9783527623051

Copyright © 2008 Wiley‐VCH Verlag GmbH & Co. KGaA

About this book

The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects.

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Front Matter (Pages: I-XXVI)

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CHAPTER 1

Introduction to 3D Integration (Pages: 1-11)

Dr. Philip Garrou

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CHAPTER 2

Drivers for 3D Integration (Pages: 13-24)

Dr. Philip Garrou,  Susan Vitkavage,  Sitaram Arkalgud

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CHAPTER 3

Overview of 3D Integration Process Technology (Pages: 25-44)

Dr. Philip Garrou,  Dr. Christopher Bower

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CHAPTER 4

Deep Reactive Ion Etching of Through Silicon Vias (Pages: 45-91)

Fred Roozeboom,  Michiel A. Blauw,  Yann Lamy,  Eric van Grunsven,  Wouter Dekkers,  Jan F. Verhoeven,  Eric(F.) van den Heuvel,  Emile van der Drift,  Erwin (W. M. M.) Kessels,  Richard (M. C. M.) van de Sanden

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CHAPTER 5

Laser Ablation (Pages: 93-105)

Wei-Chung Lo,  S. M. Chang

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CHAPTER 6

SiO2 (Pages: 107-120)

Robert Wieland

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CHAPTER 7

Insulation – Organic Dielectrics (Pages: 121-131)

Dr. Philip Garrou,  Dr. Christopher Bower

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CHAPTER 8

Copper Plating (Pages: 133-156)

Tom Ritzdorf,  Rozalia Beica,  Charles Sharbono

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CHAPTER 9

Metallization by Chemical Vapor Deposition of W and Cu (Pages: 157-173)

Armin Klumpp,  Robert Wieland,  Ramona Ecke,  Stefan E. Schulz

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CHAPTER 10

Fabrication, Processing and Singulation of Thin Wafers (Pages: 175-208)

Werner Kröninger

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CHAPTER 11

Overview of Bonding Technologies for 3D Integration (Pages: 209-221)

Jean-Pierre Joly

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CHAPTER 12

Chip-to-Wafer and Wafer-to-Wafer Integration Schemes (Pages: 223-248)

Thorsten Matthias,  Stefan Pargfrieder,  Markus Wimplinger,  Paul Lindner

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CHAPTER 13

Polymer Adhesive Bonding Technology (Pages: 249-259)

James Jian-Qiang Lu,  Tim S. Cale,  Ronald J. Gutmann

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CHAPTER 14

Bonding with Intermetallic Compounds (Pages: 261-269)

Armin Klumpp

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CHAPTER 15

Commercial Activity (Pages: 271-287)

Dr. Philip Garrou

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CHAPTER 16

Wafer-Level 3D System Integration (Pages: 289-318)

Dr. Peter Ramm,  M. Jürgen Wolf,  Bernhard Wunderle

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CHAPTER 17

Interconnect Process at the University of Arkansas (Pages: 319-337)

Susan Burkett,  Leonard Schaper

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CHAPTER 18

Vertical Interconnection by ASET (Pages: 339-373)

Kenji Takahashi,  Kazumasa Tanida

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CHAPTER 19

3D Integration at CEA-LETI (Pages: 375-392)

Barbara Charlet,  Lèa Di Cioccio,  Patrick Leduc,  David Henry

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CHAPTER 20

Lincoln Laboratory's 3D Circuit Integration Technology (Pages: 393-411)

James Burns,  Brian Aull,  Robert Berger,  Nisha Checka,  Chang-Lee Chen,  Chenson Chen,  Pascale Gouker,  Craig Keast,  Jeffrey Knecht,  Antonio Soares,  Vyshnavi Suntharalingam,  Brian Tyrrell,  Keith Warner,  Bruce Wheeler,  Peter Wyatt,  Donna Yost

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CHAPTER 21

3D Integration Technologies at IMEC (Pages: 413-430)

Eric Beyne

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CHAPTER 22

Fabrication Using Copper Thermo-Compression Bonding at MIT (Pages: 431-446)

Chuan Seng Tan,  Andy Fan,  Rafael Reif

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CHAPTER 23

Rensselaer 3D Integration Processes (Pages: 447-462)

James Jian-Qiang. Lu,  Tim S. Cale,  Ronald J. Gutmann

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CHAPTER 24

3D Integration at Tezzaron Semiconductor Corporation (Pages: 463-486)

Robert Patti

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CHAPTER 25

3D Integration at Ziptronix, Inc. (Pages: 487-503)

Paul Enquist

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CHAPTER 26

3D Integration ZyCube (Pages: 505-515)

Makoto Motoyoshi

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CHAPTER 27

Design for 3D Integration at North Carolina State University (Pages: 517-527)

Paul D. Franzon

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CHAPTER 28

Modeling Approaches and Design Methods for 3D System Design (Pages: 529-574)

Peter Schneider,  Günter Elst

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CHAPTER 29

Multiproject Circuit Design and Layout in Lincoln Laboratory's 3D Technology (Pages: 575-582)

James Burns,  Robert Berger,  Nisha Checka,  Craig Keast,  Brian Tyrrell,  Bruce Wheeler

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CHAPTER 30

Computer-Aided Design for 3D Circuits at the University of Minnesota (Pages: 583-597)

Sachin S. Sapatnekar

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CHAPTER 31

Electrical Performance of 3D Circuits (Pages: 599-621)

Arne Heittmann,  Ulrich Ramacher

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CHAPTER 32

Testing of 3D Circuits (Pages: 623-633)

T. M. Mak

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CHAPTER 33

Thermal Management of Vertically Integrated Packages (Pages: 635-649)

Thomas Brunschwiler,  Bruno Michel

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CHAPTER 34

3D and Microprocessors (Pages: 651-674)

Pat Morrow,  Sriram Muthukumar

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CHAPTER 35

3D Memories (Pages: 675-688)

Mark Tuttle

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CHAPTER 36

3D Read-Out Integrated Circuits for Advanced Sensor Arrays (Pages: 689-701)

Dr. Christopher Bower

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CHAPTER 37

Power Devices (Pages: 703-721)

Marc de Samber,  Eric van Grunsven,  David Heyes

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CHAPTER 38

Wireless Sensor Systems – The e-CUBES Project (Pages: 723-746)

Adrian M. Ionescu,  Eric Beyne,  Tierry Hilt,  Thomas Herndl,  Pierre Nicole,  Mihai Sanduleanu,  Anton Sauer,  Herbert Shea,  Maaike Taklo,  Co Van Veen,  Josef Weber,  Werner Weber,  Jürgen M. Wolf,  Peter Ramm

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Conclusions (Pages: 747-748)

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Index (Pages: 749-773)

• First Page

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