Editor(s):
Dr. Peter Ramm
Prof. Dr. James Jian‐Qiang Lu
Dr. Maaike M. V. Taklo
First published:9 February 2012
Print ISBN:9783527326464 |Online ISBN:9783527644223 |DOI:10.1002/9783527644223
Copyright © 2012 Wiley‐VCH Verlag GmbH & Co. KGaA
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.
Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.
This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries
